Use Case 4 - Industry 4.0. SC2 Semiconductor Supply Chain

INFINEON team presents the use case 4. Industry 4.0. SC2 Semiconductor Supply Chain use Case In today’s #semiconductor manufacturing (and in supply chains containing semiconductors) data is collected on a “wired” base. Integrating new “wired” sensors is time and cost-intensive. The Arrowhead Framework developed in other H2020 and ECSEL projects provides a wireless Edge standard, which is not yet applied in the semiconductor industry. The distributed nature of the Arrowhead Framework based on local clouds allows integrating wireless sensors easily, hence allowing for time-saving data generation and real-time exchange. Also, the use of AI tools just started and we are far from leveraging the full potential of AI in semiconductor supply chains and supply chains containing semiconductors. BRAINE will research the integration and value add of the BRAINE EMDC federated distributed platform as an appliance that deploys big data and AI tools and complements Arrowhead. Arrowhead and BRAINE EMDC will ensure that data collection by sensors is hence gathered non-stationary. This improves the interoperability of devices at the service level. With a cloud-based solution the required capabilities for automation within a fab are provided. This includes security, scalability and real-time control. Furthermore, interoperability among devices is realized, leading to collaborative automation within a fab, between fabs and for the entire supply chain. When the controlled systems are getting more complex and increase in size, the data to process is likewise increasing in volume. In order to provide data access immediately, wireless solutions are essential. However, operating wireless systems in a secure way requires concepts that ensure the safety of all data processed. Implementing the Arrowhead framework and the BRAINE EMDC that are capable of meeting these challenges, leads to an Industrial Internet of Things (IIoT) that is derived from a set of Cyber-Physical Systems (CPS) and upgrades existing production environments. It will improve the fabs’ flexibility and overall effectiveness and enable the fast interchange of devices.